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PRELIMINARY DATA SHEET
Solid State Relay OCMOS FET
PS7241E-1B
4-PIN SOP 400 V BREAK DOWN VOLTAGE NORMALLY CLOSE TYPE 1-ch Optical Coupled MOS FET
DESCRIPTION
The PS7241E-1B is an optically coupled element that combines a GaAs infrared LED on the input side with a normally close MOS FET on the output side to realize an excellent cost performance. The small, thin package and high sensitivity of this element makes it ideal for battery-driven mobile devices, and its small offset voltage at power-on and good linearity also make it suitable for controlling micro analog signals.
FEATURES
* Small and thin package (4-pin SOP, Height = 2.1 mm) * 1 channel type (1 b output) * Designed for AC/DC switching line changer * Low offset voltage * Ordering number of taping product: PS7241E-1B-E3, E4, F3, F4 * Pb-Free product * UL awaiting approval * BSI awaiting approval
1 2 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 4
PIN CONNECTION (Top View)
3
APPLICATIONS
* Laptop PC, PDA * Modem card * Telephone, FAX * Measurement equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information.
Document No. PN10552EJ01V0DS (1st edition) Date Published February 2005 CP(K) Printed in Japan
(c) NEC Compound Semiconductor Devices, Ltd. 2005
PS7241E-1B
PACKAGE DIMENSIONS (UNIT: mm)
4.00.5
7.00.3 4.4
2.05+0.08 -0.05
0.15+0.10 -0.05
0.05+0.08 -0.05
2.54
0.50.3
0.40+0.10 -0.05
0.25 M
2
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
ORDERING INFORMATION
Part Number Order Number Solder Plating Specification PS7241E-1B PS7241E-1B-E3 PS7241E-1B-E4 PS7241E-1B-F3 PS7241E-1B-F4 PS7241E-1B-A PS7241E-1B-E3-A PS7241E-1B-E4-A PS7241E-1B-F3-A PS7241E-1B-F4-A Embossed Tape 3 500 cs/reel Pb-Free
*2
Packing Style
Safety Standard Approval
Application Part Number
*1
Magazine case 100 pcs Embossed Tape 900 pcs/reel
UL and BSI awaiting approval
PS7241E-1B
*1 For the application of the Safety Standard, following part number should be used. *2 With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office.
ABSOLUTE MAXIMUM RATINGS (TA = 25C, unless otherwise specified)
Parameter Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current MOS FET Break Down Voltage Continuous Load Current Pulse Load Current (AC/DC Connection) Power Dissipation Isolation Voltage
*3 *2 *1
Symbol IF VR PD IFP VL IL ILP PD BV PT TA Tstg
Ratings 50 5.0 50 1 400 120 240 300 1 500 350 -40 to +85 -40 to +100
Unit mA V mW A V mA mA mW Vr.m.s. mW C C
Total Power Dissipation Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together.
Preliminary Data Sheet PN10552EJ01V0DS
3
PS7241E-1B
RECOMMENDED OPERATING CONDITIONS (TA = 25C)
Parameter LED Operating Current LED Off Voltage Symbol IF VF MIN. 3 0 TYP. 10 MAX. 20 0.5 Unit mA V
ELECTRICAL CHARACTERISTICS (TA = 25C)
Parameter Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED Off-state Current On-state Resistance Cout IFoff Ron1 Ron2 Turn-on Time
*1 *1
Symbol VF IR ILoff IF = 10 mA VR = 5 V
Conditions
MIN.
TYP. 1.2
MAX. 1.4 5.0 1.0
Unit V
A A
IF = 10 mA, VD = 400 V
IF = 10 mA, VD = 0 V, f = 1 MHz IL = 120 mA IF = 0 mA, IL = 10 mA IF = 0 mA, IL = 120 mA, t 10 ms IF = 10 mA, VO = 5 V, RL = 500 , PW 10 ms VI-O = 1.0 kVDC V = 0 V, f = 1 MHz 10
9
206 3.0 22 17 0.07 1.0 35 24 0.2 3.0
pF mA
ton toff RI-O CI-O
ms
Turn-off Time
Isolation Resistance Isolation Capacitance
0.5 pF
*1 Test Circuit for Switching Time
IF
Pulse Input VL
Input
50% 0
VO = 5 V
Input monitor VO monitor
90%
Output
Rin
RL
10% toff ton
4
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.05 4.00.1
1.750.1
1.5+0.1 -0
2.9 MAX.
12.00.2
5.50.05
1.550.1 8.00.1
7.40.1
4.60.1
2.40.1
0.3
Tape Direction
PS7241E-1B-E3
PS7241E-1B-E4
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2
180+0 -1.5
R 1.0
21.00.8
13.51.0 17.51.0
60 +1 -0
Packing: 900 pcs/reel
11.9 to 15.4 Outer edge of flange
Preliminary Data Sheet PN10552EJ01V0DS
5
PS7241E-1B
Outline and Dimensions (Tape)
2.00.05 4.00.1
1.750.1
1.5+0.1 -0
2.9 MAX.
12.00.2
5.50.05
1.550.1 8.00.1
7.40.1
4.60.1
2.40.1
0.3
Tape Direction
PS7241E-1B-F3
PS7241E-1B-F4
Outline and Dimensions (Reel)
2.00.5
3302.0
2.00.5 13.00.2
1001.0
R 1.0
21.00.8
13.00.2
13.51.0 17.51.0
Packing: 3 500 pcs/reel
11.9 to 15.4 Outer edge of flange
6
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s
260C MAX. 220C
to 60 s
180C
120C
12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Preliminary Data Sheet PN10552EJ01V0DS
7
PS7241E-1B
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
* The information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4 - 0110
8
Preliminary Data Sheet PN10552EJ01V0DS
PS7241E-1B
Caution
GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. * Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279
0406

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